3D IC & TSV Profiles (Report & Database) - Now Available

Posted on: Friday, 13 June 2008, 00:00 CDT Research and Markets Laura Wood, Senior Manager, press@researchandmarkets.com Logo: http://www.researchandmarkets.com Research and Markets (http://www.researchandmarkets.com/research/ a1d769/3d_ic_tsv_profil) has announced the addition of the "3D IC & TSV Profiles (report & database)" report to their offering. The report provides more than 300 slides ready to use for your own business. IDMs and OSATs players have been investigated. For each profile, you will have access to the following features: -- Financial highlights -- Company products and markets -- Strategic alliances & partnerships Mapping of the R&D labs and main manufacturing fabs locations: Key R&D, Front-end, Back-end, and Assembly site activities have been identified Key contacts developing the TSV technology Summary of... [read full story]